We were happy to receive a MOS 6522 Versatile Interface Adapter (VIA) from Andreas Schiffler on January 14, 2011. This chip has a notable bug, and we're excited to start looking into it.
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The die shot is stitched from 64 separate microscope shots by Greg James in San Francisco taken with a Nikon LV150 with an LU Plan Fluor 20x objective. The images were corrected and stitched automatically by Christian Sattler in the UK, using
Autopano-sift-C
and custom code. The largest image here is half the size in each dimension of the original die shot.
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