We were happy to receive a MOS 6522 Versatile Interface Adapter (VIA) from Andreas Schiffler on January 14, 2011. This chip has a notable bug, and we're excited to start looking into it.
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The die shot is stitched from 64 separate microscope shots by Greg James in San Francisco taken with a Nikon LV150 with an LU Plan Fluor 20x objective. The images were corrected and stitched automatically by Christian Sattler in the UK, using
and custom code. The largest image here is half the size in each dimension of the original die shot.
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